Integrated memory

ABSTRACT

Some embodiments include an integrated memory having an array of capacitors. The array has edges. The capacitors along the edges are edge capacitors, and the other capacitors are internal capacitors. The edge capacitors have inner edges facing toward the internal capacitors, and have outer edges in opposing relation to the inner edges. An insulative beam extends laterally between the capacitors. The insulative beam is along upper regions of the capacitors. First void regions are under the insulative beam, along lower regions of the internal capacitors, and along the inner edges of the edge capacitors. Peripheral extensions of the insulative beam extend laterally outward of the edge capacitors, and second void regions are under the peripheral extensions and along the outer edges of the edge capacitors. Some embodiments included integrated assemblies having two or more memory array decks stacked on atop another. Some embodiments include methods of forming memory arrays.

TECHNICAL FIELD

Integrated memory, integrated assemblies, and methods of forming memoryarrays. The memory arrays may include memory cells which individuallycomprise capacitors and transistors.

BACKGROUND

Memory is one type of integrated circuitry, and is used in computersystems for storing data. Memory may be fabricated in one or more arraysof individual memory cells. Memory cells may be written to, or readfrom, using digit lines (which may also be referred to as bitlines, datalines, sense lines, or data/sense lines) and access lines (which mayalso be referred to as wordlines). The digit lines may conductivelyinterconnect memory cells along columns of the array, and the accesslines (i.e., wordlines) may conductively interconnect memory cells alongrows of the array. Each memory cell may be uniquely addressed throughthe combination of a digit line and an access line.

Memory cells may be volatile or nonvolatile. Nonvolatile memory cellscan store data for extended periods of time including when the computeris turned off. Volatile memory dissipates and therefore requires beingrefreshed/rewritten, in many instances multiple times per second.Regardless, memory cells are configured to retain or store memory in atleast two different selectable states. In a binary system, the statesare considered as either a “0” or a “1”. In other systems, at least someindividual memory cells may be configured to store more than two levelsor states of information.

A capacitor is one type of electronic component that may be used in amemory cell. A capacitor has two electrical conductors separated byelectrically insulating material. Energy as an electric field may beelectrostatically stored within such material. Depending on thecomposition of the insulator material, the stored field will be volatileor nonvolatile. For example, a capacitor insulator material includingonly SiO₂ will be volatile. One type of nonvolatile capacitor is aferroelectric capacitor which has ferroelectric material as at leastpart of the insulating material. Ferroelectric materials arecharacterized by having two stable polarized states and thereby cancomprise programmable material of a capacitor and/or memory cell. Thepolarization state of the ferroelectric material can be changed byapplication of suitable programming voltages, and remains after removalof the programming voltage (at least for a time). Each polarizationstate has a different charge-stored capacitance from the other, andwhich ideally can be used to write (i.e., store) and read a memory statewithout reversing the polarization state until such is desired to bereversed. Less desirable, in some memory having ferroelectric capacitorsthe act of reading the memory state can reverse the polarization.Accordingly, upon determining the polarization state, a re-write of thememory cell is conducted to put the memory cell into the pre-read stateimmediately after its determination. Regardless, a memory cellincorporating a ferroelectric capacitor ideally is nonvolatile due tothe bi-stable characteristics of the ferroelectric material that forms apart of the capacitor. Other programmable materials may be used ascapacitor insulator to render capacitors nonvolatile.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a diagrammatic cross-sectional side view of an exampleintegrated structure having a portion of an example memory arraysupported over a region peripheral to the memory array.

FIGS. 2 and 3 are top-down views of portions of example memory arrays,with the views of FIGS. 2 and 3 being generally downward along adirection indicated by the line A-A in FIG. 1.

FIGS. 4-6 are diagrammatic schematic diagrams of example memory cellarrangements; with FIG. 4 showing a 1T1C arrangement, FIG. 5 showing a2T1C arrangement, and FIG. 6 showing a 2T2C arrangement.

FIGS. 7 and 8 are top-down views of portions of example memory arrays,with the views of FIGS. 7 and 8 being generally downward along adirection indicated by the line B-B in FIG. 1.

FIG. 9 is top-down view of an example wordline arrangement, with theview of FIG. 9 being generally downward along a direction indicated bythe line C-C in FIG. 1.

FIG. 10 is top-down view of an example bitline arrangement, with theview of FIG. 10 being generally downward along a direction indicated bythe line D-D in FIG. 1.

FIGS. 11-14 are diagrammatic cross-sectional side views of examplearrangements of memory array decks in integrated structures.

FIGS. 15-18 are diagrammatic cross-sectional side views of an exampleintegrated structure at process stages of an example method.

FIGS. 19-21 are diagrammatic cross-sectional side views of additionalexample integrated structures.

DETAILED DESCRIPTION OF THE ILLUSTRATED EMBODIMENTS

Some embodiments include integrated memory having memory cellscomprising capacitors. The capacitors are arranged in an array. Voidregions are provided between the capacitors of the array to provideisolation between neighboring capacitors. Void regions may providebetter isolation between neighboring capacitors as compared to solid orsemisolid insulative materials. Specifically, if solid or semisolidinsulative materials are utilized, there may be problematic capacitivecoupling across neighboring capacitors. The capacitive coupling maycause data loss from memory cells due to the capacitive states of thememory cell capacitors being disturbed as neighboring capacitors areprogrammed or otherwise accessed. Utilization of void regions betweenneighboring capacitors may alleviate, or even entirely prevent theproblematic capacitive coupling across neighboring capacitors. In someembodiments, the capacitors may comprise ferroelectric insulativematerial, and in some embodiments the capacitors may comprise onlynon-ferroelectric insulative material.

Some embodiments include integrated assemblies having stacked memoryarray decks. The decks differ from one another in either the type ofcapacitors utilized (e.g., one of the decks may utilize capacitorshaving ferroelectric insulative material, and the other of the decks mayutilize capacitors having only non-ferroelectric insulative material)and/or in an arrangement of capacitors and transistors (e.g., one of thedecks may have a 1T1C arrangement and the other may have a 2T1Carrangement, a 2T2C arrangement, etc.)

Some embodiments include methods of forming memory arrays which havevoid regions between neighboring capacitors.

Example embodiments are described with reference to FIGS. 1-21.

Referring to FIG. 1, a construction 10 comprises portion of a memoryarray region 12, over a portion of a region 14. The region 14 may beconsidered to be peripheral to the memory array region 12. Theperipheral region 14 is shown to be spaced from the memory array region12 by a gap. Such gap is utilized to indicate that there may be othermaterials or structures between the peripheral region 14 and the memoryarray region 12 in some embodiments. Although the peripheral region 14is shown to be under the memory array region 12, in other embodiments atleast a portion of the peripheral region 14 may be beside the memoryarray region 12 and/or at least a portion of the peripheral region 14may be over the memory array region 12.

The memory array region 12 includes a plurality of memory cells 16. Eachof the memory cells 16 includes a capacitor 18 over and electricallycoupled with a transistor 20. The memory cells 16 (e.g., capacitors 18and transistors 20) are arranged within an array 22.

Each of the capacitors 18 includes a first electrode 24, a secondelectrode 26, and a capacitor insulative material 28 between the firstand second electrodes 24/26.

The first electrodes 24 may comprise any suitable composition orcombination of combinations; such as, for example, one or more ofvarious metals (e.g., titanium, tungsten, cobalt, nickel, platinum,etc.), metal-containing compositions (e.g., metal silicide, metalnitride, metal carbide, etc.), and/or conductively-doped semiconductormaterials (e.g., conductively-doped silicon, conductively-dopedgermanium, etc.). In some embodiments, the first electrodes 24 maycomprise, consist essentially of, or consist of titanium nitride.

The second electrodes 26 may comprise any suitable composition orcombination of compositions; such as, for example, one or more ofvarious metals (e.g., titanium, tungsten, cobalt, nickel, platinum,etc.), metal-containing compositions (e.g., metal silicide, metalnitride, metal carbide, etc.), and/or conductively-doped semiconductormaterials (e.g., conductively-doped silicon, conductively-dopedgermanium, etc.). In some embodiments, the second electrodes 26 maycomprise, consist essentially of, or consist of one or more ofmolybdenum silicide, titanium nitride, titanium silicon nitride,ruthenium silicide, ruthenium, molybdenum, tantalum nitride, tantalumsilicon nitride and tungsten.

Although the first and second electrodes 24/26 are shown to behomogeneous in the embodiment of FIG. 1, it is to be understood thateither or both of the electrodes 24 and 26 may instead comprise two ormore different materials.

The first and second electrodes 24/26 may comprise any suitablethicknesses; and in some embodiments may comprise thicknesses within arange of from about 20 Å to about 100 Å.

The capacitor insulative material 28 may comprise any suitablecomposition or combination of compositions. For instance, in someembodiments the capacitor insulative material 28 may comprise, consistessentially of, or consist of non-ferroelectric insulative material;such as, for example, one or more of silicon dioxide, silicon nitride,high-k dielectric (for instance, aluminum oxide, hafnium oxide,zirconium oxide, etc.). In some embodiments, at least some of thecapacitor insulative material 28 may comprise ferroelectric insulativematerial. The ferroelectric insulative material may include one or moreof transition metal oxide, zirconium, zirconium oxide, niobium, niobiumoxide, hafnium, hafnium oxide, lead zirconium titanate, and bariumstrontium titanate, and may have dopant therein which comprises one ormore of silicon, aluminum, lanthanum, yttrium, erbium, calcium,magnesium, strontium, and a rare-earth element.

In embodiments in which the capacitor insulative material comprises onlynon-ferroelectric compositions, the memory cells 16 may be volatile(e.g., the capacitors 18 may have operational characteristicscorresponding to the volatile characteristics associated withtraditional dynamic random access memory (DRAM)).

In embodiments in which the capacitor insulative material comprises oneor more ferroelectric compositions, the memory cells 16 may benonvolatile, or at least may have reduced volatility as compared to thevolatility associated with traditional DRAM.

In embodiments in which the capacitor insulative material 28 comprises aferroelectric composition, the array 22 may be referred to asferroelectric memory; and in embodiments in which the capacitorinsulative material 28 comprises only one or more non-ferroelectriccompositions, the array 22 may be referred to as non-ferroelectricmemory.

Although the capacitor insulative material 28 is shown to be homogeneousin the embodiment of FIG. 1, it is to be understood that the capacitorinsulative material 28 may instead comprise two or more differentcompositions.

The capacitor insulative material 28 may comprise any suitablethickness, and in some embodiments may comprise a thickness within arange of from about 30 Å to about 100 Å.

The capacitors 18 may be formed to any suitable height, H; such as, forexample, a height within a range of from about 200 nanometers (nm) toabout 1500 nm.

The illustrated capacitors 18 are container-type capacitors (i.e., thefirst electrode 24 of each capacitor is shaped as an upwardly-openingcontainer, and the insulative 28 and second electrode 26 extend intosuch upwardly-opening container). In other embodiments, the capacitors18 may have other configurations, such as, for example stud capacitorconfigurations.

Two of the capacitors 18 along the cross-section of FIG. 1 are shown tobe at edges of the array 22, and such capacitors may be referred to asedge capacitors 30. The remaining capacitors 18 may be referred to asinternal capacitors 32, as such remaining capacitors are internal withinthe array 22 rather than being at the edges of the array. Accordingly,all of the capacitors of array 22 may be referred to as capacitors 18;or the group of capacitors 18 may be broken into subgroups, with one ofsuch subgroups being the edge capacitors 30 and the other of thesubgroups being the internal capacitors 32. The edge capacitors 30 maybe structurally identical to the internal capacitors 32 in all respectsexcept that the edge capacitors 30 are along edges of the array 22 andthe internal capacitors 32 are not along the edges of the array 22.

The edge capacitors 30 may be considered to have inner edges 31 facingthe internal capacitors 32, and to have outer edges 33 in opposingrelation to the inner edges 31.

All of the capacitors 18 may be considered to have upper regions 34 andlower regions 36 (the regions 34/36 are illustrated relative to one ofthe edge capacitors 30, but it is to be understood that all of thecapacitors 18 comprise similar regions 34/36).

An insulative beam 38 extends laterally between the capacitors 18, andis along the upper regions 34 of the capacitors 18. The insulative beam38 comprises a material 40. Such material 40 may be any suitableinsulative composition or combination of insulative compositions;including, for example, silicon dioxide, silicon nitride, aluminumoxide, etc. The material 40 may be homogenous (as shown), or maycomprise two or more discrete compositions.

The insulative beam 38 has a central region 42 which extends between thecapacitors 18, and has peripheral extensions 44 which extend laterallyoutward of the edge capacitors 30. In some applications, the insulativebeam 38 may be considered to be a lattice structure which supports thecapacitors 18 (for instance, which may alleviate or prevent undesiredtoppling of one or more of the capacitors 18). In some embodiments, thecapacitors may have sufficient support so that such lattice structuremay be omitted. In some embodiments, the capacitors may benefit fromadditional support besides the illustrated single lattice of beam 38,and accordingly additional lattice structures may be provided (asdiscussed in more detail below with reference to FIG. 21).

Conductive plate material 46 is over the capacitors 18, and iselectrically coupled with the second electrodes 26 of the capacitors. Inthe shown embodiment, the conductive plate material 46 is dividedamongst two conductive plates 48. In other embodiments, there may beonly a single conductive plate 48, or there may be more than twoconductive plates 48 (examples of such other embodiments are describedbelow with reference to FIGS. 7 and 8). If the capacitors 18 compriseonly non-ferroelectric insulative material 28 (i.e., are capacitors of atype utilized in conventional DRAM), it may be preferable to have only asingle plate 48 extending across all of the capacitors of the array 22.Alternatively, if the capacitors 18 comprise ferroelectric insulativematerial 28, it may be preferable to have two or more plates 48associated with the array 22. Each of the plates 48 may be referred toas a common plate (CP). The common plate(s) may be coupled with anysuitable voltage, such as, for example, a voltage within a range of fromgreater than or equal to ground to less than or equal to VCC (i.e.,ground≤CP≤VCC). In some applications, a common plate is at a voltage ofabout one-half VCC (i.e., about VCC/2).

The conductive plate material 46 may comprise any suitable electricallyconductive composition, such as, for example, one or more of variousmetals (e.g., titanium, tungsten, cobalt, nickel, platinum, etc.),metal-containing compositions (e.g., metal silicide, metal nitride,metal carbide, etc.), and/or conductively-doped semiconductor materials(e.g., conductively-doped silicon, conductively-doped germanium, etc.).In some embodiments, the conductive plate material 46 may comprise oneor more of tungsten, copper, titanium nitride, tungsten silicide, etc.).The conductive plate material 46 may be homogenous (as shown), or maycomprise two or more discrete compositions.

An insulative structure 52 is over the conductive plates 48. Theinsulative structure 52 comprises insulative material 50. Suchinsulative material may comprise any suitable composition or combinationof compositions; including, for example, silicon nitride, aluminumoxide, etc. The insulative material 50 may be homogenous (as shown), ormay comprise two or more discrete compositions.

The insulative structure 52 has lateral edge regions (i.e., verticalregions) 54 which extend downwardly and surround the capacitors 18 ofarray 22. Although regions 54 may be referred to as “vertical regions”it is to be understood that such vertical regions may or may not extendorthogonally relative to upper surfaces of underlying materials.Instead, the term “vertical regions” is utilized to indicate that theregions 54 extend downwardly along the edges of the array 22, ratherthan extending laterally across the array 22.

The capacitors 18 within the array 22 are electrically isolated from oneanother by void regions 56. Specifically, the void regions 56 are underthe insulative beam 38 and between the internal capacitors 32, and alsoare between the inner edges 31 of the edge capacitors 30 and theinternal capacitors 32.

Additional void regions 58 are between the outer edges 33 of the edgecapacitors and the lateral edge regions 54 of the insulative structure52. Such additional void regions 58 are beneath the peripheralextensions 44 of the insulative beam 38.

In some embodiments, the void regions 56 may be referred to as firstvoid regions, and the void regions 58 may be referred to as second voidregions.

The void regions 56/58 may be gassed-filled regions, and in suchembodiments may contain air, nitrogen, and/or any other suitable gas.

An insulative support structure 62 is under the capacitors 18. Thesupport structure 62 may comprise any suitable insulative material 60;including, for example, one or more of silicon dioxide, silicon nitride,aluminum oxide, etc. The material 60 may be homogenous (as shown), ormay comprise two or more discrete compositions.

Transistors 20 are supported within the insulative support structure 62.Each of the transistors 20 comprises a pillar 64 of semiconductormaterial 66. The semiconductor material 66 may comprise any suitablecomposition or combination of compositions; including, for example, oneor more of silicon, germanium, etc.

The semiconductor material 66 within each of the pillars 64 isappropriately doped to comprise a first source/drain region 68, a secondsource/drain region 70, and a channel region 72 between the first andsecond source/drain regions. Dashed-lines are provided within thepillars 64 to diagrammatically illustrate approximate boundaries betweenthe source/drain regions 68/70 and the channel regions 72. Although thesource/drain regions are illustrated to be physically distinctstructures, in other embodiments the source/drain regions may not bephysically distinct.

The first source/drain regions 68 are electrically coupled with thefirst electrodes 24 of capacitors 18.

Each of the transistors 20 has gate material 74 along the channel region66, and spaced from the channel region by gate insulator material 76.

The gate material 74 may comprise any suitable composition orcombination of compositions; such as, for example, one or more ofvarious metals (e.g., titanium, tungsten, cobalt, nickel, platinum,etc.), metal-containing compositions (e.g., metal silicide, metalnitride, metal carbide, etc.), and/or conductively-doped semiconductormaterials (e.g., conductively-doped silicon, conductively-dopedgermanium, etc.). The gate material 74 may be homogenous (as shown), ormay comprise two or more discrete compositions.

The gate insulator material 76 may comprise any suitable composition orcombination of compositions; including, for example, silicon dioxide,aluminum oxide, hafnium oxide, zirconium oxide, ferroelectric material,etc. The gate insulator material 76 may be homogenous (as shown), or maycomprise two or more discrete compositions.

The gate material 74 is comprised by wordlines that extend in and out ofthe page relative to the cross-sectional view of FIG. 1. Such wordlinesare schematically illustrated as wordlines WL-1, WL-2, WL-3, WL-4 andWL-5 in the diagram of FIG. 1.

A bitline, BL-1, is under the transistors 20, and is electricallycoupled with the second source/drain regions 70 of such transistors. Thebitline BL-1 comprises bitline material 78. Such bitline material maycomprise any suitable composition or combination of compositions; suchas, for example, one or more of various metals (e.g., titanium,tungsten, cobalt, nickel, platinum, etc.), metal-containing compositions(e.g., metal silicide, metal nitride, metal carbide, etc.), and/orconductively-doped semiconductor materials (e.g., conductively-dopedsilicon, conductively-doped germanium, etc.). The bitline material 78may be homogenous (as shown), or may comprise two or more discretecompositions.

The illustrated memory cells 16 are examples of a few of a largeplurality of memory cells that may extend across the array 22. Forinstance, the array 22 may comprise hundreds, thousands. millions etc.of memory cells. The illustrated wordlines (e.g., WL-1, WL-2, WL-3, WL-4and WL-5) are examples of a large plurality of wordlines that may extendacross the array 22, and the illustrated bitline (e.g., BL-1) is anexample bitline of a large plurality of bitlines that may extend acrossthe array 22. The wordlines may extend along rows of the array 22, andthe bitlines may extend along columns of the array 22. The wordlines andbitlines extend linearly and may be straight in some applications; orcurvy, wavy, etc. in other applications. The wordlines and bitlinescross one another; and in some embodiments the bitlines may extendsubstantially orthogonally relative to the wordlines. Each memory cell16 may be uniquely addressed through the combination of a wordline and abitline.

The bitlines (e.g., BL-1) and the capacitors and wordlines thereover maybe considered to be comprised by a deck 80. In the illustratedembodiment, the periphery 14 is comprised by a base 82 that supports thedeck 80. Such base 82 may comprise semiconductor material; and may, forexample, comprise monocrystalline silicon. The base 82 may be referredto as a semiconductor substrate. The term “semiconductor substrate”means any construction comprising semiconductive material, including,but not limited to, bulk semiconductive materials such as asemiconductive wafer (either alone or in assemblies comprising othermaterials), and semiconductive material layers (either alone or inassemblies comprising other materials). The term “substrate” refers toany supporting structure, including, but not limited to, thesemiconductor substrates described above. In some applications, the base82 may correspond to a semiconductor substrate containing one or morematerials associated with integrated circuit fabrication. Such materialsmay include, for example, one or more of refractory metal materials,barrier materials, diffusion materials, insulator materials, etc. Forinstance, in the illustrated embodiment the base 82 comprises theperipheral region 14 having circuitry 84 utilized for driving thewordlines (e.g., WL-1, WL-2, WL-3, WL-4 and WL-5), and circuitry 86utilized for driving the bitlines (e.g., BL-1). The circuities 84 and 86may comprise, for example, CMOS and/or any other suitable circuitry. Thecircuities 84 and 86 may be laterally spaced from one another (as shown)or may overlap.

The configuration of FIG. 1 shows the internal capacitors 32 laterallysurrounded by the first void regions 56, and shows the edge capacitors30 laterally surrounded by combinations of first void regions 56 andsecond void regions 58. The environment around a capacitor may influenceelectrical properties of the capacitor. Accordingly, if the second voidregions 58 are sufficiently similar to the first void regions 56, theedge capacitors 30 may have electrical properties similar to, or evenidentical to, the internal capacitors 32. In such embodiments, the edgecapacitors 30 and internal capacitors 32 may all be incorporated intofunctioning memory cells 16 of integrated memory. Alternatively, if thevoid regions 58 are substantially different from the void regions 56, ormissing altogether, the edge capacitors 30 may have dissimilarelectrical properties relative to the internal capacitors 32. In suchapplications, problematic edge capacitors may be incorporated into dummystructures rather than being comprised by functioning memory cells ofintegrated memory. The dummy structures are structurally similar to thememory cells 16, but are functionally different. Specifically, the dummystructures operate simply as placeholders along the edge of the array 22and are not programmed, addressed, or otherwise utilized in functioningmemory cells.

The configuration of the peripheral extensions 44 of the beam 38 mayinfluence characteristics of the second void regions 58, and accordinglymay determine if one or more of the edge capacitors 30 is utilized as adummy structure rather than being incorporated into a functioning memorycell. FIGS. 2 and 3 show top-down views along a direction indicated bythe line A-A of FIG. 1, and show example arrays 22 of capacitors 18(only some of the capacitors 18 are labeled in each of the views ofFIGS. 2 and 3 to simplify the drawings). The views of FIGS. 2 and 3 arenot to the same scale as the view of FIG. 1. The arrays 22 of FIGS. 2and 3 comprise 25 capacitors. In actual practice, the arrays maycomprise many more capacitors (for instance, hundreds, thousands,millions, tens of millions, etc.), but only 25 capacitors areillustrated in order to simplify the drawings.

Each of the arrays of FIGS. 2 and 3 is square-shaped, and has edges88-91.

The embodiment of FIG. 2 has beam 38 (material 40) extending outwardlybeyond the array 22 along all of the edges 88-91, and accordingly theperipheral extensions 44 extend outwardly beyond all of the edgecapacitors. Thus, void regions 58 (FIG. 1) may be provided outwardly ofall of the edge capacitors, and in some embodiments all of the edgecapacitors may be incorporated into functioning memory cells 16 (FIG.1).

In contrast, the embodiment of FIG. 3 has beam 38 (material 40)extending outwardly beyond the array 22 only along the edges 88 and 90,and not along the edges 89 and 91. Thus, the peripheral extensions 44extend outwardly past the edge capacitors along the edges 88 and 90, butdo not extend outwardly beyond the edge capacitors along the edges 89and 91. Accordingly, void regions 58 (FIG. 1) may be provided outwardlyof the edge capacitors along edges 88 and 90, but are not providedoutwardly of the edge capacitors along the edges 89 and 91. This maycause the edge capacitors along the edges 89 and 90 to have differentelectrical properties as compared to other capacitors within the array22, and it may be advantageous to effectively “quarantine” such edgecapacitors by incorporating them into dummy structures rather than intofunctioning memory cells.

Referring again to FIG. 1, the memory cells 16 and transistors 20 of thememory array 22 may be utilized in various arrangements XTYC, where Xand Y are integers, T is transistor and C is capacitor. Sucharrangements may include, for example, 1T1C, 2T1C and 2T2C; any whichmay be utilized with either ferroelectric memory or non-ferroelectricmemory. Example 1T1C, 2T1C and 2T2C configurations are described withreference to FIGS. 4-6.

Referring to FIG. 4, an array 22 is shown comprising memory cells in the1T1C configuration. Specifically, each memory cell 16 comprises atransistor 20 in combination with a capacitor 18. The illustrated regionof the array 22 comprises wordlines WL-1 and WL-2, and comprisesbitlines BL-1 and BL-2. Each memory cell 16 is uniquely addressed by thecombination of a wordline and a bitline.

Referring to FIG. 5, an array 22 is shown comprising a memory cell inthe 2T1C configuration. Specifically, the memory cell 16 comprises twotransistors 20 in combination with a single capacitor 18. Theillustrated region of the array 22 comprises wordline WL-1, andcomprises bitlines BL-1 and BL-2. The bitlines BL-1 and BL-2 may bereferred to as comparative bitlines, in that electrical properties(e.g., voltage) of the two are compared (utilizing circuitry 92) toascertain a memory state of memory cell 16.

Referring to FIG. 6, an array 22 is shown comprising a memory cell inthe 2T2C configuration. Specifically, the memory cell 16 comprises twotransistors 20 in combination with two capacitors 18. The illustratedregion of the array 22 comprises wordline WL-1, and comprises bitlinesBL-1 and BL-2. The bitlines BL-1 and BL-2 may be comparative bitlinessimilar to those described above with reference to FIG. 5.

Referring again to FIG. 1, the conductive plate material 46 may beprovided as a single conductive plate 48, or as multiple conductiveplates. FIGS. 7 and 8 show top-down views along a direction indicated bythe line B-B of FIG. 1, and show example arrays 22 of capacitors 18 (thecapacitors 18 are shown in dashed-line view to indicate that they arebelow the planes of the cross-sections of FIGS. 7 and 8). The views ofFIGS. 7 and 8 are not to the same scale as the view of FIG. 1.

FIG. 7 shows the conductive plate material 46 subdivided amongst fourdifferent conductive plates 48 across the array 22, and FIG. 8 shows theconductive plate material 46 as a single conductive plate extendingacross an entirety of the array 22.

Any suitable number of conductive plates 48 may be utilized across thearray 22. The appropriate number of conductive plates 48 may depend inpart on the capacitance and configuration of capacitors 18. Forinstance, it may be advantageous to utilize only a single conductiveplate 48 extending across all of the capacitors 18 of non-ferroelectricmemory, and it may be advantageous to utilize multiple differentconductive plates 48 extending across an array of ferroelectric memory.If multiple different conductive plates 48 are utilized, the conductiveplates may be all the same size and shape as one another (as shown inFIG. 7), or in other embodiments at least one of the conductive plates48 may be of a different size and/or shape as compared to at least oneother of the conductive plates 48.

Referring again to FIG. 1, the first and second void 56 and 58 are shownextending along lower regions 36 of the capacitors 18, and stopping onthe insulative material 60 that extends between the transistors 20. Inother embodiments, the first void regions 56 (and possibly also thesecond void regions 58) may extend downwardly to between the transistors20, and possibly may also extend downwardly to between the bitlines(e.g., BL-1) beneath transistors 20. For instance, FIGS. 9 and 10 showtop-down views along directions indicated by the lines C-C and D-D ofFIG. 1, respectively, and show void regions extending downwardly tobetween wordlines and bitlines. The views of FIGS. 9 and 10 are not tothe same scale as the view of FIG. 1.

Referring to FIG. 9, the void regions 56 are shown extending downwardlyto be in regions 94 between adjacent rows (i.e., to be between thewordlines (e.g., WL-2, WL-3 and WL-4)), and also to be in regions 96along the rows. In some embodiments, solid or semisolid insulativematerial (for instance, silicon nitride, silicon dioxide, etc.) may bewithin the regions 96 along the rows, and the void regions 56 may bewithin the regions 94 between the rows; or the solid/semisolidinsulative material may be within the regions 94 and the void regionsmay be within the regions 96.

Referring to FIG. 10, the void regions 56 are shown extending downwardlyto be between bitlines (e.g., BL-1, BL-2 and BL-3).

It may be advantageous in some embodiments for the void regions 56(and/or 58) to extend downwardly between the wordlines (as shown in FIG.9) in that such may reduce capacitive coupling between adjacentwordlines as compared to utilization of solid or semisolid insulativematerial. Similarly, in some embodiments it may be advantageous for thevoid regions 56 (and/or 58) to extend downwardly between the bitlines(as shown in FIG. 10).

In some embodiments, multiple memory array decks (e.g., the deck 80 ofFIG. 1) may be stacked one atop another in an integrated structure. Atleast one of the decks may differ relative to another of the decks inthe memory cell arrangement of transistors and capacitors (e.g., one ofthe decks may have memory cells in a 1T1C arrangement, while another ofthe decks has memory cells in either a 2T1C arrangement or a 2T2Carrangement), and/or at least one of the decks may compriseferroelectric memory while another comprises non-ferroelectric memory.In some embodiments, at least some of the decks may comprise a samememory cell arrangement of transistors and capacitors as one another,and in some embodiments all of the decks may comprise a same memory cellarrangement of transistors and capacitors as one another. Exampleembodiments of stacked memory deck arrangements are described withreference to FIGS. 11-14.

Referring to FIG. 11, a construction 10 a includes a first deck D₁ overa second stack D₂, which in turn is over a peripheral region 14associated with a base 82. Each of the decks D₁ and D₂ comprises memorycells 16 having capacitors 18 and transistors 20 of the type describedabove with reference to FIG. 1. Each of the decks D₁ and D₂ alsocomprises conductive plate material 46, and comprises bitline material78.

In the illustrated embodiment, the capacitors 18 are spaced from oneanother by solid and/or semisolid insulative material 98 (e.g., silicondioxide, silicon nitride, etc.), and the supporting lattice of FIG. 1(insulative beam 38) is not shown. In other embodiments, at least one ofthe decks D₁ and D₂ may comprise the insulative beam 38, and maycomprise void regions between the capacitors 18, and possibly alsobetween wordlines beneath the capacitors, and possibly also betweenbitlines beneath the wordlines. In other words, at least one of thedecks D₁/D₂ may have a configuration analogous to that described withreference to FIG. 1 relative to the deck 80.

The lower deck D₂ comprises wordlines (e.g., WL-1, WL-2 and WL-3) whichextend to circuitry 84 associated with peripheral region 14, andcomprises bitlines (e.g., BL-1) which extend to circuitry 86 associatedwith the peripheral region 14. The upper deck D₁ comprises wordlines(e.g., WL-4, WL-5 and WL-6) which extend to circuitry 100 associatedwith peripheral region 14, and comprises bitlines (e.g., BL-2) whichextend to circuitry 102 associated with the peripheral region 14.

The illustrated memory array decks D₁ and D₂ may be part of anarrangement comprising multiple additional memory array decks over theupper deck D₁.

In some embodiments, the peripheral region may be subdivided intomultiple segments (e.g., segments 104, 106, etc.), with each segmenthaving circuitry configured for addressing individual memory arraydecks. For instance, one of the decks D₁/D₂ may comprise ferroelectricmemory, while the other of the decks D₁/D₂ comprises non-ferroelectricmemory; and one of the illustrated regions 104/106 may comprisecircuitry suitable for utilization with the ferroelectric memory (e.g.,memory in which capacitor insulative material 26 comprises at least oneferroelectric material) while the other of the regions 104/106 comprisescircuitry suitable for utilization with the non-ferroelectric memory(e.g., memory in which the capacitor insulative material 26 comprisesonly non-ferroelectric material). In some embodiments, the ferroelectricmemory may be associated with the upper deck D₁ while thenon-ferroelectric memory is associated with the lower deck D₂; and inother embodiments the non-ferroelectric memory may be associated withthe upper deck D₁ while the ferroelectric memory is associated with thelower deck D₂.

As another example, one of the decks D₁/D₂ may comprise memory cells ina 1T1C arrangement, while the other of the decks D₁/D₂ comprises memorycells in a different arrangement (e.g., 2T1C, 2T2C, etc.), and one ofthe illustrated regions 104/106 may comprise circuitry suitable forutilization with the 1T1C arrangement while the other of the regions104/06 comprises circuitry suitable for utilization with the otherarrangement. In such embodiments, one of the decks D₁/D₂ may be referredto as comprising first transistors electrically coupled with firstcapacitors in a first arrangement XTYC (where X and Y are integers, T istransistor and C is capacitor), and the other of the decks D₁/D₂ may bereferred to as comprising second transistors electrically coupled withsecond capacitors in a second arrangement PTQC (where X and Y areintegers, T is transistor and C is capacitor); with the secondarrangement comprising a different number of transistors as compared tothe first arrangement (i.e., where X is different than P), and/or withthe second arrangement comprising a different number of capacitors ascompared to the first arrangement (i.e., where Y is different than Q).In some embodiments, the arrangements XTYC and PTQC are arrangementsselected from the group consisting of 1T1C, 2T1C and 2T2C.

Although the embodiment of FIG. 11 shows wordlines and bitlines from theupper deck D₁ extending to a different segment (104 or 106) of theperipheral region 14 than the wordlines and bitlines from the lower deckD₂, in other embodiments the wordlines and bitlines from both of thedecks D₁ and D₂ may extend to common circuitry associated with theperipheral region, as shown in a construction 10 b of FIG. 12.

FIG. 13 shows a construction 10 c which schematically illustrates anembodiment in which multiple memory decks D_(1-n) are stacked over aperipheral region 14 associated with a base 82, and in which each of thedecks has wordlines (WL(1-n)) and bitlines (BL(1-n)) extending to commoncircuitry 84/86 associated with the peripheral region 14. Any of thedecks may have a configuration analogous to that of deck 80 in FIG. 1,and accordingly may have void regions 56/58 extending betweencapacitors, and possibly extending to between wordlines beneath thecapacitors, and possibly also extending to between bitlines beneath thewordlines. The decks D_(1-n) may comprise ferroelectric memory ornon-ferroelectric memory.

In some embodiments, one or more of decks D_(1-n) may differ relative toanother of the decks in having a different configuration of void regions56/58 (FIG. 1). For instance, one of the decks may have void regions56/58 while another of the decks lacks such void regions; one of thedecks may have void regions 56/58 extending downwardly to betweenwordlines, while the other of the decks does not have void regionsextending downwardly to between wordlines; one of the decks may havevoid regions 56/58 extending downwardly to between bitlines, while theother of the decks does not have void regions extending downwardly tobetween the bitlines, etc.

FIG. 14 shows a construction 10 d which schematically illustrates anembodiment in which multiple memory decks D_(1-n) are stacked over aperipheral region 14 associated with a base 82, and in which some of thedecks have wordlines (WL(1-n)) and bitlines (BL(1-n)) extending tocommon circuitry 84/86 associated with the peripheral region 14, whileat least one other of the decks has wordlines (WL(1-n)) and bitlines(BL(1-n)) extending to different circuitry 100/102 associated with theperipheral region 14. Any of the decks may have a configurationanalogous to that of deck 80 in FIG. 1, and accordingly may have voidregions 56/58 extending between capacitors, and possibly extending tobetween wordlines beneath the capacitors, and possibly also extending tobetween bitlines beneath the wordlines. The decks D_(1-n) may compriseferroelectric memory or non-ferroelectric memory.

In some embodiments, one or more of decks D_(1-n) of FIG. 14 may differrelative to another of the decks in having a different configuration ofvoid regions 56/58 (FIG. 1). In some embodiments, the deck havingwordlines and bitlines extending to the different circuitry 100/102(deck D₂) may differ from the other decks in the type of memory (forinstance, deck D₂ may comprise ferroelectric memory while the otherdecks comprise non-ferroelectric memory, or vice versa). In someembodiments, the deck having wordlines and bitlines extending to thedifferent circuitry 100/102 (deck D₂) may differ from the other decks inthe arrangement of transistors and capacitors (for instance, deck D₂ maycomprise a XTYC arrangement while the other decks comprise PTQCarrangements, where P, Q, X and Y are integers, T is transistor and C iscapacitor; and where X is different than P and/or where Y is differentthan Q).

The various structures described herein may be formed utilizing anysuitable methodology. FIGS. 15-18 describe example methods which may beutilized to form the configuration of FIG. 1.

Referring to FIG. 15, construction 10 is shown comprising a matrix 200over the transistors 20 and the supporting material 60 between thetransistors. The matrix 200 includes the insulative material 40 ofinsulative beam 38, and includes sacrificial material 202 beneath theinsulative material 40. In some embodiments, the support material 60 maybe replaced with sacrificial material 202; and in some embodiments thesacrificial material 202 may also extend down to beneath the transistors20 and between the bitlines (e.g., BL-1).

The sacrificial material 202 may comprise any suitable composition orcombination of compositions; and in some embodiments may compriseborophosphosilicate glass. In some example embodiments, the insulativematerial 40 of beam 38 may consist essentially of, or consist of siliconnitride, and the sacrificial material 202 may consist essentially of, orconsist of borophosphosilicate glass. The sacrificial material 202 maythen be readily removed selectively relative to the silicon nitride ofbeam 38 utilizing, for example, a wet etch comprising hydrofluoric acid.In some embodiments, the insulative support material 60 may comprisesilicon nitride and/or another composition resistant to an etch utilizedto remove sacrificial material 202; and in other embodiments theinsulative support material 60 may comprise one or more compositionswhich are removed with the etch utilized to remove sacrificial material202.

Referring to FIG. 16, the capacitors 18 are formed to extend through thematrix 200, with the capacitors being distributed within the array 22.The capacitors 18 be formed by etching openings through the matrix 200utilizing a patterned mask to define locations of the openings (forinstance, a patterned photoresist mask, which is not shown); removingthe mask, and then depositing suitable materials within the openings toform the electrodes 24/26 and the capacitor insulative material 28. Thedepositions of the materials of capacitors 18 may utilize any suitablechemistries and methodology; and in some embodiments may utilize one ormore of atomic layer deposition (ALD), chemical vapor deposition (CVD),physical vapor deposition (PVD), etc. The specific deposition techniquesutilized to form materials of the capacitors 18 may include multiplesteps. For instance, the first electrode 24 may be formed and thenetched back so that the upper surface of the first electrode is recessedwithin the openings (and in the shown embodiment is recessed to a levelat or below a bottom level of insulative material 40). Subsequently,capacitor insulative material 28 may be formed within anupwardly-opening container defined by the first electrode 24; with thecapacitor insulative material 28 forming another upwardly-openingcontainer. Then, the second electrode 26 may be formed to fill theupwardly-opening container of capacitor insulative material 28.

The conductive plate material 46 is formed over insulative material 40and across upper surfaces of capacitors 18 to be electrically coupledwith the second electrodes 26. In the illustrated embodiment, thecapacitor plate material 46 is patterned into two capacitor plates 48along the cross-section section of FIG. 16. In other embodiments, thecapacitor plate material 46 may be patterned into only a singleconductive plate 48 that extends across the entirety of the array 22, ormay be patterned into more than two conductive plates 48.

The capacitors 18 and transistors 20 together form the array of memorycells 16.

Two of the capacitors 18 are edge capacitors 30 analogous to thosedescribed above with reference to FIG. 1, and the remaining capacitors18 are internal capacitors 32. The edge capacitors have inner surfaces(i.e., inner edges) 31 facing the internal capacitors 32, and have outersurfaces (i.e., outer edges) 33 in opposing relation to the innersurfaces 31.

The insulative beam 38 extends laterally between the capacitors 30/32,and has peripheral extensions 44 that extend laterally outwardly beyondthe edge capacitors 30.

The matrix 200 having the capacitors 30/32 therein may be referred to asan assembly in some embodiments.

Referring to FIG. 17, the sacrificial material 202 (FIG. 16) is removedto form the first void regions 56 under the insulative beam 38, and toform the second void regions 58 along the outer surfaces 33 of the edgecapacitors 30. The sacrificial material 202 may be removed with anysuitable etch, including, for example, the hydrofluoric acid etchdescribed above. In the shown embodiment, material 60 remains afterremoving the sacrificial material 202, but in other embodiments material60 may also be removed so that the void regions 56/58 extend downwardlyto between the wordlines (e.g., WL-1, WL-2, WL-3, WL-4 and WL-5) to formstructures analogous to the structure described above with reference toFIG. 9. Further, in some embodiments the void regions 56/58 extenddownwardly to between the bitlines (e.g., BL-1) to form structuresanalogous to the structure described above with reference to FIG. 10.

Referring next to FIG. 18, insulative material 50 is formed over theconductive plate material 46 and across insulative beam 38 to form theinsulative structure 52. The insulative material 50 may be depositedutilizing any process, including, for example, a plasma-enhanced process(for instance plasma-enhanced chemical vapor deposition, PECVD). Theinsulative material 50 may be deposited with low (poor) step coverage toform the illustrated structure having the vertical regions 54 of theinsulative structure 52 that remain spaced from the outer surfaces 33 ofedge capacitors 30 by the second void regions 58.

In the embodiment of FIGS. 15-18, the sacrificial material 202 (FIG. 15)is removed subsequent to the formation of the conductive plates 48, andprior to the formation of the insulative material 50. In otherembodiments, the sacrificial material 202 may be removed at otherprocessing stages. For instance, the sacrificial material 22 may beremoved prior to formation of the conductive plates 48 in someembodiments. As another example, the sacrificial material 202 may beremoved after formation of the insulative material 50 in someembodiments, provided that sacrificial material 202 and insulativematerial 50 are of different compositions such that the sacrificialmaterial 202 may be selectively removed relative to the insulativematerial 50.

The embodiment of FIG. 18 has large second void regions 58 along theouter surfaces 33 of the edge capacitors 30. Such may enable the edgecapacitors 30 to have comparable electrical properties relative to theinternal capacitors 32 so that the edge capacitors may be incorporatedinto functional memory cells 16 of the array 22. If the edge capacitors30 do not have comparable electrical properties relative to the internalcapacitors 32, the internal capacitors 32 may be incorporated intofunctional memory cells 16 while the edge capacitors 30 are insteadincorporated into dummy devices.

FIGS. 19 and 20 illustrate alternative embodiments in which theperipheral extensions 44 of the insulative beam 38 are reduced in size(FIG. 19) or entirely eliminated (FIG. 20, which shows an embodiment inwhich the entire insulative beam 38 is eliminated). The embodiments ofFIGS. 19 and 20 have the first void regions 56 between the internalcapacitors 32, but either entirely lack the second void regions 58 alongouter surfaces 33 of the edge capacitors 30 (FIG. 20) or have muchsmaller void regions 58 that only extend along portions of the outersurfaces 33 (FIG. 19).

In some embodiments, the edge capacitors 30 may still have suitableelectrical properties in either or both of the embodiments of FIGS. 19and 20 to be incorporated into functional memory cells 16 of the array22. In other embodiments, the edge capacitors 30 of either or both ofthe embodiments of FIGS. 19 and 20 will not have suitable electricalproperties to be utilized in functional memory cells, and instead willsimply be dummy structures along the edges of arrays 22.

In some embodiments, it may be desired to form additional supportinglattices besides the insulative beam 38. FIG. 21 shows a construction 10e having a supporting lattice 220 along the bottoms of the capacitors30/32 in addition to having the supporting lattice of insulative beam 38along the tops of the capacitors 30/32. In other embodiments, otherlattices may be formed between the lattice 220 and the insulative beam38, or the lattice 220 may be replaced with another lattice that ishigher up on the capacitors instead of being along the bottoms of thecapacitors. The lattice 220 comprises insulative material 222. Theinsulative material 222 may comprise a same composition as theinsulative material 40 of beam 38 in some embodiments; and may, forexample, comprise, consist essentially of, or consist of siliconnitride. Utilization of multiple lattices to support the capacitors30/32 may become increasingly advantageous as the capacitors 30/32become increasingly tall and thin with increasing levels of integration.

The structures, arrays and assemblies discussed above may beincorporated into electronic systems. Such electronic systems may beused in, for example, memory modules, device drivers, power modules,communication modems, processor modules, and application-specificmodules, and may include multilayer, multichip modules. The electronicsystems may be any of a broad range of systems, such as, for example,cameras, wireless devices, displays, chip sets, set top boxes, games,lighting, vehicles, clocks, televisions, cell phones, personalcomputers, automobiles, industrial control systems, aircraft, etc.

Unless specified otherwise, the various materials, substances,compositions, etc. described herein may be formed with any suitablemethodologies, either now known or yet to be developed, including, forexample, atomic layer deposition (ALD), chemical vapor deposition (CVD),physical vapor deposition (PVD), etc.

Both of the terms “dielectric” and “electrically insulative” may beutilized to describe materials having insulative electrical properties.The terms are considered synonymous in this disclosure. The utilizationof the term “dielectric” in some instances, and the term “electricallyinsulative” in other instances, may be to provide language variationwithin this disclosure to simplify antecedent basis within the claimsthat follow, and is not utilized to indicate any significant chemical orelectrical differences.

The particular orientation of the various embodiments in the drawings isfor illustrative purposes only, and the embodiments may be rotatedrelative to the shown orientations in some applications. The descriptionprovided herein, and the claims that follow, pertain to any structuresthat have the described relationships between various features,regardless of whether the structures are in the particular orientationof the drawings, or are rotated relative to such orientation.

The cross-sectional views of the accompanying illustrations only showfeatures within the planes of the cross-sections, and do not showmaterials behind the planes of the cross-sections, unless indicatedotherwise, in order to simplify the drawings.

When a structure is referred to above as being “on” or “against” anotherstructure, it can be directly on the other structure or interveningstructures may also be present. In contrast, when a structure isreferred to as being “directly on” or “directly against” anotherstructure, there are no intervening structures present.

Some embodiments include an integrated memory which includes an array ofcapacitors. The array has edges, and the capacitors along the edges areedge capacitors. The capacitors that are not along the edges areinternal capacitors of the array. The edge capacitors have inner edgesfacing toward the internal capacitors, and have outer edges in opposingrelation to the inner edges. The capacitors have upper regions, and havelower regions beneath the upper regions. An insulative beam extendslaterally between the capacitors. The insulative beam is along the upperregions of the capacitors. First void regions are under the insulativebeam, along the lower regions of the internal capacitors, and along theinner edges of the edge capacitors. Peripheral extensions of theinsulative beam extend laterally outward of at least some of the edgecapacitors, and second void regions are under the peripheral extensionsand along the outer edges of said at least some of the edge capacitors.

Some embodiments include an integrated memory which includes capacitors.The capacitors have first electrodes, second electrodes, and insulativecapacitor material between the first and second electrodes. Thecapacitors have lower regions, and have upper regions over the lowerregions. The capacitors are arranged in array. The array comprisesedges, and the capacitors along the edges are edge capacitors. Thecapacitors that are not along the edges are internal capacitors of thearray. the edge capacitors have inner edges facing toward the internalcapacitors, and have outer edges in opposing relation to the inneredges. An insulative beam extends laterally between the capacitors. Theinsulative beam is along the upper regions of the capacitors. First voidregions are under the insulative beam, along the lower regions of theinternal capacitors, and along the inner edges of the edge capacitors.Peripheral extensions of the insulative beam extend laterally outward ofthe edge capacitors, and second void regions are under the peripheralextensions and along the outer edges of the edge capacitors. Transistorsare under the capacitors. The transistors have first source/drainregions, second source/drain regions, and channel regions between thefirst and second source/drain regions. The first source/drain regionsare electrically coupled with the first electrodes of the capacitors.Wordlines (i.e., access lines) are along the channel regions, and extendalong rows of the array. Bitlines (i.e., digit lines) are electricallycoupled with the second source/drain regions of the transistors, andextend along columns of the array. at least one conductive plate is overthe array and electrically coupled with the second electrodes of thecapacitors. An insulative structure is over the at least one conductiveplate and has lateral edge regions extending downwardly and surroundingthe array. The lateral edge regions of the insulative structure arespaced from the outer edges of the edge capacitors by the second voidregions.

Some embodiments include an integrated assembly which includes a firstmemory array deck comprising first memory cells having first capacitorscontaining only non-ferroelectric insulative material; and whichincludes a second memory array deck comprising second memory cellshaving second capacitors containing ferroelectric insulative material. Abase supports the first and second memory array decks.

Some embodiments include an integrated assembly which includes a firstmemory array deck having first transistors electrically coupled with thefirst capacitors in a first arrangement XTYC; where X and Y areintegers, T is transistor and C is capacitor. The integrated assemblyalso includes second memory array deck having second transistorselectrically coupled with the second capacitors in a second arrangementPTQC; where P and Q are integers, T is transistor and C is capacitor;and where P is different from X and/or Q is different from Y. A basesupports the first and second memory array decks.

Some embodiments include a method of forming a memory array. An assemblyis formed which comprises capacitors extending within a matrix. Thecapacitors have first electrodes, second electrodes, and insulativecapacitor material between the first and second electrodes. Thecapacitors are arranged in array. The array comprises edges, and thecapacitors along the edges are edge capacitors. The capacitors that arenot along the edges are internal capacitors of the array. The edgecapacitors have inner edges facing toward the internal capacitors, andhaving outer edges in opposing relation to the inner edges. The matrixincludes an insulative beam over a sacrificial material. the insulativebeam extends laterally between the capacitors and is along the upperregions of the capacitors. The insulative beam has peripheral extensionsthat extend laterally beyond the edge capacitors. The sacrificialmaterial is removed to form first void regions under the insulativebeam, along the lower regions of the internal capacitors, and along theinner edges of the edge capacitors; and to form second void regionsalong the outer edges of the edge capacitors. At least one conductiveplate is formed over the insulative beam and is electrically coupledwith the second electrodes. An insulative structure is formed over theat least one conductive plate. The insulative structure includessubstantially vertical regions along the outer edges of the edgecapacitors and spaced from the outer edges of the edge capacitors by thesecond void regions.

In compliance with the statute, the subject matter disclosed herein hasbeen described in language more or less specific as to structural andmethodical features. It is to be understood, however, that the claimsare not limited to the specific features shown and described, since themeans herein disclosed comprise example embodiments. The claims are thusto be afforded full scope as literally worded, and to be appropriatelyinterpreted in accordance with the doctrine of equivalents.

1. (canceled) 2: Integrated memory, comprising: an array of capacitors;the array comprising edges and the capacitors along the edges being edgecapacitors; the capacitors that are not along the edges being internalcapacitors of the array; the edge capacitors having inner edges facingtoward the internal capacitors, and having outer edges in opposingrelation to the inner edges; the capacitors having upper regions, andhaving lower regions beneath the upper regions; an insulative beamextending laterally between the capacitors, the insulative beam beingalong the upper regions of the capacitors; first void regions beingunder the insulative beam, along the lower regions of the internalcapacitors, and along the inner edges of the edge capacitors; peripheralextensions of the insulative beam extending laterally outward of atleast some of the edge capacitors, and second void regions being underthe peripheral extensions and along the outer edges of said at leastsome of the edge capacitors; and an insulative structure over the arrayof capacitors and over the insulative beam; the insulative structurehaving lateral edge regions extending downwardly and being outward ofthe outer edges of said at least some of the edge capacitors; thelateral edge regions of the insulative structure being spaced from theouter edges of said at least some of the edge capacitors by the secondvoid regions. 3: The integrated memory of claim 2, wherein one or moreof the edge capacitors are dummy structures which are not comprised byfunctioning memory cells of the integrated memory. 4: The integratedmemory of claim 2, wherein said at least some of the edge capacitors isall of the edge capacitors. 5: The integrated memory of claim 4, whereinall of the edge capacitors are comprised by functioning memory cells ofthe integrated memory. 6: Integrated memory, comprising: capacitors; thecapacitors having first electrodes, second electrodes, and insulativecapacitor material between the first and second electrodes; thecapacitors having lower regions and upper regions over the lowerregions; the capacitors being arranged in array, the array comprisingedges and the capacitors along the edges being edge capacitors; thecapacitors that are not along the edges being internal capacitors of thearray; the edge capacitors having inner edges facing toward the internalcapacitors, and having outer edges in opposing relation to the inneredges; an insulative beam extending laterally between the capacitors,the insulative beam being along the upper regions of the capacitors;first void regions being under the insulative beam, along the lowerregions of the internal capacitors, and along the inner edges of theedge capacitors; peripheral extensions of the insulative beam extendinglaterally outward of the edge capacitors and second void regions beingunder the peripheral extensions and along the outer edges of the edgecapacitors; transistors under the capacitors and having first regions,second regions, and channel regions between the first and secondregions; the first regions being electrically coupled with the firstelectrodes of the capacitors; access lines along the channel regions,and extending along rows of the array; digit lines electrically coupledwith the second regions of the transistors, and extending along columnsof the array; at least one conductive plate over the array andelectrically coupled with the second electrodes of the capacitors; andan insulative structure over the at least one conductive plate andhaving lateral edge regions extending downwardly and surrounding thearray; the lateral edge regions of the insulative structure being spacedfrom the outer edges of the edge capacitors by the second void regions.7: The integrated memory of claim 6, comprising a lattice structurebeneath the insulative beam and extending between the capacitors. 8: Theintegrated memory of claim 6, wherein one or more of the edge capacitorsare dummy structures which are not comprised by functioning memory cellsof the integrated memory. 9: The integrated memory of claim 6, whereinall of the edge capacitors are comprised by functioning memory cells ofthe integrated memory. 10: The integrated memory of claim 6, wherein theinsulative capacitor material comprises ferroelectric material. 11: Theintegrated memory of claim 6, wherein the insulative capacitor materialcomprises only non-ferroelectric material. 12: The integrated memory ofclaim 6, wherein the first void regions extend downwardly to between theaccess lines. 13: The integrated memory of claim 12, wherein the digitlines are under the access lines, and wherein the first void regionsextend downwardly to between the digit lines. 14-33. (canceled)